Project
As part of a wafer production process, thickness measurements are made using a laser triangulation sensor.  SPC charts were created manually, a tedious, error-prone process.

Result
We interfaced with the laser sensor directly and acquired measurements by clearly prompting operators through the measurement process. SPC charts are created automatically, with statistical data displayed and stored in exactly the format the customer desired.

Technologies utilized

• SPC X-bar and Range graphs
• Built-in database (native format)
• Table-driven data perusal
• Reports – aggregate and traveler
• Laser displacement sensors
• Simple, intuitive user interface

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